ligitek electronics co.,ltd. property of ligitek only lead-free parts pb round type led lamps data sheet doc. no : qw0905-ldgl53133z/l16 rev. : a date : 16 - apr. - 2007 ldgl53133z/l16
ligitek electronics co.,ltd. property of ligitek only 5.8 5.0 1.5max 8.65 7.65 1/5 page part no. ldgl53133z/l16 package dimensions 1.0min + - 2.54typ 30 -30 0 60 100% 75% 50% 25% 25%0 75%50% directivity radiation note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. -60 100% 0.5 typ 25.0min - dgl zener +
505 water clear typical electrical & optical characteristics (ta=25 ) symbol esd t opr tstg i f pd i fp absolute maximum ratings at ta=25 note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. color lens ingan/gan material ldgl53133z/l16 part no green emitted peak forward current duty 1/10@10khz forward current electrostatic discharge( * ) operating temperature reverse current @5v storage temperature power dissipation parameter 11500 luminous intensity @20ma(mcd) typ. 32 spectral halfwidth nm dominant wave length dnm 4.0 max. forward voltage @ ma(v) 3.5 typ. 20 6200 min. viewing angle 2 1/2 (deg) 24 ligitek electronics co.,ltd. property of ligitek only 30 ir50 8000 120 100 ratings dgl a v mw ma ma unit page2/5 -20 ~ +80 -30 ~ +100 static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. * ldgl53133z/l16 part no.
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 dgl chip page 3/5 450 0.0 0.5 1.0 500 550 600 ldgl53133z/l16 part no.
ligitek electronics co.,ltd. property of ligitek only 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) page 4/5 5 /sec max temp( c) 260 260 c3sec max time(sec) 150 100 2 /sec max 120 25 preheat 50 0 0 60 seconds max note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) ldgl53133z/l16 part no.
reference standard mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 page 5/5 description test condition reliability test: test item 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) low temperature storage test high temperature storage test operating life test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. ligitek electronics co.,ltd. property of ligitek only mil-std-202:103b jis c 7021: b-11 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles solder resistance test thermal shock test high temperature high humidity test 1.t.sol=230 5 2.dwell time=5 1sec solderability test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. this test intended to see soldering well performed or not. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hours. ldgl53133z/l16 part no.
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